Contents
List of Symbols .....................................................................xiii
1 The Thermoelectric and Related Effects .................................... 1
1.1 Introduction ............................................................. 1
1.2 Relations Between the Thermoelectric Coefficients .................. 3
1.3 Effects in a Magnetic Field............................................. 5
References ....................................................................... 6
2 Theory of Thermoelectric Refrigeration and Generation................. 7
2.1 The Transport Effects .................................................. 7
2.2 Thermoelectric Refrigerators and Heat Pumps........................ 8
2.3 Thermoelectric Generators ............................................. 13
2.4 Multi-Stage Devices .................................................... 15
2.5 Application of the Thermomagnetic Effects .......................... 17
References ....................................................................... 21
3 Thermoelectric Properties of Metals and Semiconductors ............... 23
3.1 Transport by Electrons ................................................. 23
3.2 Metals and Semiconductors ............................................ 29
3.3 Bipolar Effects .......................................................... 34
3.4 Phonon Conduction..................................................... 36
3.5 Phonon Drag ............................................................ 39
References ....................................................................... 41
4 Optimisation and Selection of Semiconductor Thermoelements ......... 43
4.1 Power Factor ............................................................ 43
4.2 The Materials Parameter, ˇ ............................................ 44
4.3 Mobility and Effective Mass ........................................... 46
4.4 The Lattice Thermal Conductivity in Pure Crystals .................. 47
4.5 The Effect of Temperature ............................................. 50
4.6 The Importance of the Energy Gap .................................... 51
4.7 Non-Parabolic Bands ................................................... 53
x Contents
4.8 ThermomagneticMaterials............................................. 55
4.9 Superconductors as Passive Thermoelements ......................... 60
References ....................................................................... 61
5 Minimising the Thermal Conductivity ...................................... 63
5.1 Semiconductor Solid Solutions ........................................ 63
5.2 Phonon Scattering by Point Defects ................................... 64
5.3 Boundary Scattering .................................................... 70
5.4 Scattering of Electrons and Phonons .................................. 72
5.5 Fine-Grained Material with Large Unit Cells ......................... 74
5.6 Phonon-Glass Electron-Crystal ........................................ 76
References ....................................................................... 78
6 The Improvement of a Specific Material – Bismuth Telluride............ 79
6.1 Pure Bismuth Telluride ................................................. 79
6.2 Band Structure of Bismuth Telluride .................................. 82
6.3 Diffusion in Bismuth Telluride......................................... 86
6.4 Solid Solutions Based on Bismuth Telluride .......................... 87
6.5 Practical Developments ................................................ 90
6.6 Extension of the Temperature Range .................................. 93
6.7 Recent Advances ....................................................... 96
References ....................................................................... 97
7 Methods for the Production of Materials ................................... 99
7.1 General Principles ...................................................... 99
7.2 Growth From the Melt ..................................................100
7.3 Sintering ................................................................105
7.4 Thick and Thin films ...................................................109
References .......................................................................110
8 Measurement Techniques .....................................................113
8.1 General Considerations.................................................113
8.2 Electrical Conductivity .................................................114
8.3 Seebeck Coefficient ....................................................118
8.4 Thermal Conductivity ..................................................121
8.5 Thermal Diffusivity.....................................................126
8.6 The Figure of Merit .....................................................128
8.7 ThermomagneticMeasurements .......................................135
References .......................................................................138
9 Review of ThermoelectricMaterials ........................................139
9.1 Bismuth and Bismuth–Antimony ......................................139
9.2 Lead Telluride and Related Compounds...............................148
9.3 Silicon–Germanium Alloys ............................................151
9.4 Skutterudites and Clathrates ...........................................154
9.4.1 Skutterudites ....................................................154
9.4.2 Clathrates .......................................................156
9.5 Oxides ...................................................................159
9.6 Other ThermoelectricMaterials........................................160
9.6.1 Zinc Antimonide ...............................................160
9.6.2 Half-Heusler Compounds ......................................161
9.6.3 Metal Silicides ..................................................162
9.6.4 Boron Carbide ..................................................163
References .......................................................................164
10 Thermoelectric Modules and Their Application ...........................167
10.1 The Modular Concept ..................................................167
10.2 Heat Transfer Problems ................................................171
10.3 Electrical Contact Resistance ..........................................174
10.4 Applications of the Peltier Effect ......................................176
10.5 Transient Cooling.......................................................179
10.6 Seebeck Devices ........................................................182
References .......................................................................188
11 Transverse Devices ............................................................191
11.1 Features of Transverse Coolers and Generators .......................191
11.2 Synthetic Transverse Thermoelements ................................192
11.3 Materials for Transverse Thermoelements ............................195
11.4 Alternative Configurations .............................................200
References .......................................................................201
12 Properties of NanostructuredMaterials ....................................203
12.1 Theory of Nanostructures ..............................................203
12.2 Thermal Conduction in Low-DimensionalMaterials .................208
12.3 Observations on Nanostructures .......................................213
12.4 Preparation of Nanostructures .........................................216
References .......................................................................219
13 Thermionic Energy Conversion..............................................221
13.1 Vacuum Thermoelements ..............................................221
13.2 Thermionic Emission in Solids ........................................228
References .......................................................................233
Bibliography ........................................................................235
Index .................................................................................237
Index of Elements, Compounds and Alloys .....................................241補充信息：
出版社：Springer
Springer Series in Material Science ISSN 0933-033X
ISBN 978-3-642-00715-6 e-ISBN 978-3-642-00716-3
DOI 10.1007/978-3-642-00716-3
Springer Heidelberg Dordrecht London New York
Library of Congress Control Number: 2009929170
頁數(shù)：250頁

[ Last edited by 穿越千年 on 2015-12-2 at 02:48 ]

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