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[In a typical fabrication procedure, a two-electrode configuration of the electrochemical system was used. A copper gauze 140 mesh woven, wire
diameter ≈ 50 μm) substrate was used as a working electrode and a copper plate was used as a counter electrode. Here, the copper plate (counter electrode) was polished using a sandpaper to remove surface contaminants before the electrodeposition process. The Cu NPF was then grown by electrodeposition in an aqueous electrolyte containing 0.05 m CuSO4, 0.1 m NaBr (or NaCl), and 0.1 m H2SO4 at a deposition voltage of −0.2 V for 20 s, and subsequently in the voltage range of −0.9 to −1.8 V for 200–300 s. After electrodeposition of the Cu NPF, the sample was rinsed in a deionized (DI) water bath for 10 min to remove the remaining reactant ions (e.g., Cu2+, Br–, and H2SO4) on its surface.] -----10.1002/aenm.201803764
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