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采用低摩擦和三點(diǎn)彎夾具提升DMA的測量性能
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| For modulus measurements, the purest form of evaluation occurs when using 3-point bending and rectangular samples. If, however, the sample has a twist along its length, then there is only partial contact between the clamp and the sample across its width at the middle. This creates an artifact in the thermal curves of an apparent increase in the storage modulus just before the onset of the glass transition. New low-friction selfadjusting 3-point bending clamps, offered by TA instruments, eliminate this artifact. |
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2017-02-22 16:15:36, 393.39 K
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