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SCI期刊Micromachines (IF:2.523) ?鞲
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Special Issue Title: Advanced MEMS and Optical System Assembly and Integration 客座編輯: Prof. Dr. Jianping Chen Dr. Di Sun Dr. Yu Jin 征稿范圍: The research and development of advanced MEMS and optical systems has attracted attention from both academia and industry. They are tremendously valuable for enabling new applications including augmented reality/mixed reliability (AR/MR), autonomous driving systems (ADS), unmanned aerial vehicles (UAV), optical image stabilization (OIS) and robotic vision. The whole system requires the integration of multiple components, such as MEMS scanning mirrors, laser diodes, micro-LED arrays, waveguides, image sensors, and time-of-flight (ToF) sensors. There is a strong need to develop advanced assembly and packaging processes for the individual component or large component arrays. Meanwhile, new ideas of system-level co-design and optical mechanical architecture are necessary to improve performance, miniaturization, yield, and reliability. In this Special Issue, we would like to invite you to contribute research papers, communications, and review articles related to advanced MEMS and optical system assembly and integration architectures, designs, processes, testing approaches and simulations. Topics of interest for publication include but are not limited to: Micro-led array assembly Self-assembly/fluidic assembly Pick and place Flip-chip bonding Adhesives/ACF 3D assembly TSV, hybrid bond Multi-chip module/chiplet Optomechanical alignment Encapsulation Reliability Simulation 特刊詳情頁鏈接:https://www.mdpi.com/journal/mic ... ssembly_integration 截止日期:2021.10.10 聯(lián)系郵箱:micromachines@mdpi.com 歡迎同學(xué)老師們積極投稿! 謝謝各位專家、老師、同學(xué)的大力支持! |
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