 |
 |
 |
 |
 |
 |
||
 |
 |
 |
 |
 |
| 5 | 1/1 | 返回列表 |
| 查看: 403 | 回復: 2 | |||
| 當前只顯示滿足指定條件的回帖，點擊這里查看本話題的所有回帖 | |||
jhait木蟲 (小有名氣)
|
[交流]
【求助】鍵合教材Semiconductor Wafer Bonding: Science and Technology【已搜索無重? 已有1人參與
|
||
|
Publisher Comments: A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering. Product Details ISBN:9780471574811 Subtitle:Science and Technology Author:Gosele, U. Author  uml Author:G . Author:sele, U. Author:Gu Author:sele Author:Tong, Q. -Y Author:& Author:Gvsele, U. Author:Tong, Q. Y. Publisher:Wiley-Interscience Location:New York : Subject:Engineering - Electrical & Electronic Subject:Engineering - General Subject:Electronics - Semiconductors Subject:Semiconductors Subject:Chemistry - Physical & Theoretical Subject:Semiconductor wafers. Subject:Bonding Subject:Electricity Subject:Semiconductors -- Bonding. Series:Electrochemical Society Series Volume:33 Publication Date  ecember 1998 Binding:Hardcover Grade Level:General/trade Language:English Illustrations:Yes Pages:320 Dimensions:960x598x78 125  |
回復此樓» 猜你喜歡
材料求調(diào)劑 一志愿哈工大總分298分，前三科223分
已經(jīng)有5人回復
-
085600 286分 材料求調(diào)劑
已經(jīng)有6人回復
-
086502化學工程342求調(diào)劑
已經(jīng)有4人回復
-
材料求調(diào)劑一志愿哈工大324
已經(jīng)有7人回復
-
328求調(diào)劑
已經(jīng)有7人回復
-
340求調(diào)劑
已經(jīng)有5人回復
-
一志愿南昌大學324求調(diào)劑
已經(jīng)有4人回復
-
求調(diào)劑推薦 材料 304
已經(jīng)有15人回復
-
291求調(diào)劑
已經(jīng)有19人回復
-
331環(huán)境科學與工程求調(diào)劑
已經(jīng)有3人回復
» 本主題相關(guān)價值貼推薦，對您同樣有幫助:
- Nanoscale 悲劇， 轉(zhuǎn)投catalysis science and technology 求助
已經(jīng)有16人回復
- water science and technology 投稿
已經(jīng)有7人回復
- Journal of Dispersion Science and Technology 已在線，但為什么看不到全文啊
已經(jīng)有4人回復
- 關(guān)于water science and technology 的小疑問
已經(jīng)有8人回復
- 投稿已過1年多的LWT-Food Science and Technology
已經(jīng)有3人回復
- 昨天收到Oil & Gas Science and Technology 的一篇文章要求審稿
已經(jīng)有9人回復
- IOP的雜志measurement science and technology就是垃圾
已經(jīng)有12人回復
- 請教關(guān)于Journal of Adhesion Science and Technology！
已經(jīng)有32人回復
- Tayor & Francis的Journal of Dispersion Science and Technology請進
已經(jīng)有7人回復
- 【請教】Virtual Journal of Nanoscale Science and Technology影響力如何
已經(jīng)有7人回復
- 投稿Composites Science and Technology求助
已經(jīng)有14人回復
- 【2010-6-20】International Symposium on Mechanical Science and Technology
已經(jīng)有21人回復
- 誰在Water Science and Technology投過文章
已經(jīng)有14人回復
jhait
木蟲 (小有名氣)
- 應助: 0 (幼兒園)
- 金幣: 1610.6
- 散金: 15
- 紅花: 1
- 帖子: 159
- 在線: 97.1小時
- 蟲號: 91731
- 注冊: 2005-09-07
- 專業(yè): 半導體光電子器件
3樓2010-07-22 02:18:53
jhait
木蟲 (小有名氣)
- 應助: 0 (幼兒園)
- 金幣: 1610.6
- 散金: 15
- 紅花: 1
- 帖子: 159
- 在線: 97.1小時
- 蟲號: 91731
- 注冊: 2005-09-07
- 專業(yè): 半導體光電子器件
2樓2010-07-20 09:42:53
| 最具人氣熱帖推薦 [查看全部] | 作者 | 回/看 | 最后發(fā)表 | |
|---|---|---|---|---|
|
[考研] 289求調(diào)劑 +8 | 新時代材料 2026-03-27 | 8/400 |
|
|---|---|---|---|---|
|
[考研] 086000調(diào)劑 +3 | 7901117076 2026-03-26 | 3/150 |
|
|
|
[考研] 265求調(diào)劑11408 +3 | 劉小鹿lu 2026-03-27 | 3/150 |
|
|
|
[考研] 266分求材料化工冶金礦業(yè)等專業(yè)的調(diào)劑 +4 | 哇呼哼呼哼 2026-03-26 | 4/200 |
|
|
|
[考研] 材料292調(diào)劑 +12 | 橘頌思美人 2026-03-23 | 12/600 |
|
|
|
[考研] 308求調(diào)劑 +6 | 墨墨漠 2026-03-27 | 6/300 |
|
|
|
[考研] 一志愿北化085600材料專碩275|有文章專利｜求調(diào)劑 +3 | Micky11223 2026-03-25 | 3/150 |
|
|
|
[考研] 08開頭275求調(diào)劑 +4 | 拉誰不重要 2026-03-26 | 4/200 |
|
|
|
[考研] 化學308分求調(diào)劑 +8 | 你好明天你好 2026-03-23 | 9/450 |
|
|
|
[考研] 考研調(diào)劑 +10 | 呼呼？~+123456 2026-03-24 | 10/500 |
|
|
|
[考研] 調(diào)劑 +3 | 李嘉圖·S·路 2026-03-27 | 3/150 |
|
|
|
[考研] 一志愿吉大071010，316分求調(diào)劑 +3 | xgbiknn 2026-03-27 | 3/150 |
|
|
|
[考研] 349求調(diào)劑 +5 | 杰斯塔里斯 2026-03-21 | 5/250 |
|
|
|
[考研] 336材料求調(diào)劑 +7 | 陳瀅瑩 2026-03-26 | 9/450 |
|
|
|
[考研] 321求調(diào)劑 +6 | wasdssaa 2026-03-26 | 6/300 |
|
|
|
[考研]
 085602化學工程求調(diào)劑。
+4
|
平樂樂樂 2026-03-26 | 4/200 |
|
|
|
[考研] 材料277求調(diào)劑 +5 | min3 2026-03-24 | 5/250 |
|
|
|
[考研] 一志愿哈工大，085400，320，求調(diào)劑 +4 | gdlf9999 2026-03-24 | 4/200 |
|
|
|
[考研] 276求調(diào)劑 +3 | YNRYG 2026-03-21 | 4/200 |
|
|
|
[考研] 一志愿北京化工大學070300 學碩336求調(diào)劑 +5 | vv迷 2026-03-21 | 8/400 |
|