[交流] 【求助】芯片在高過載應(yīng)力下的受力仿真模擬

如題，最近跟著導(dǎo)師后面做項目
我做的這一塊是針對彈上芯片受力情況的模擬
使用的工具是Ansys12.0
由于是計算機專業(yè)的以前從來沒有接觸過ANSYS軟件對力學(xué)也是一竅不通
自己搞了一段時間成效甚少只好向各位路過的大神求教�。。�！
/UNITS,SI
/FILNAME,MCM_CHIP
/TITLE,2D OVERLOAD SIMULATION OF MULTICHIP MODULE

!定義封裝外殼
*SET,ENCAP_WL,14.1E-3
*SET,ENCAP_HEIGHT,1E-3

!定義芯片尺寸
*SET,CHIP_WL,ENCAP_WL/2
*SET,CHIP_HEIGHT,ENCAP_HEIGHT/4

!定義引腳尺寸
*SET,PIN_X1,1E-3 !0.4E-3
*SET,PIN_X2,0.2E-3
*SET,PIN_X3,0.4E-3
*SET,PIN_HEIGHT,0.8E-3
*SET,PIN_THICK,4E-5
*SET,PIN_WIDTH,0.3E-3
*SET,PIN_DIST,0.8E-3
*SET,PIN_NB,16

!單元類型
/PREP7
ET,1,SOLID95
!設(shè)定為平面應(yīng)變問題？
!KEYOPT,1,3,2

!定義芯片材料屬性
MP,EX,1,131E9
MP,PRXY,1,0.30
MP,DENS,1,2300
!MP,ALPX,1,2.8E-6

!定義芯片下焊料凸點的材料屬性
MP,EX,2,30E9
MP,PRXY,2,0.35
MP,DENS,2,7298

!定義封裝材料
MP,EX,3,3E9
MP,PRXY,3,0.38
MP,DENS,3,980

!定義銅屬性
MP,EX,4,115E9
MP,PRXY,0,33
MP,DENS,4,8900

BLOCK,-ENCAP_WL/2,ENCAP_WL/2,-ENCAP_WL/2,ENCAP_WL/2,0,ENCAP_HEIGHT

BLOCK,-CHIP_WL/2,CHIP_WL/2,-CHIP_WL/2,CHIP_WL/2,ENCAP_HEIGHT/2,CHIP_HEIGHT

K,100,-ENCAP_WL/2+ENCAP_WL/18,-ENCAP_WL/2+0.7*PIN_X1,ENCAP_HEIGHT/2
K,101,-ENCAP_WL/2+ENCAP_WL/18,-ENCAP_WL/2-0.3*PIN_X1,ENCAP_HEIGHT/2
K,102,-ENCAP_WL/2+ENCAP_WL/18,-ENCAP_WL/2-0.4*PIN_X1,0
K,103,-ENCAP_WL/2+ENCAP_WL/18,-ENCAP_WL/2-0.8*PIN_X1,0

k,104,-ENCAP_WL/2+ENCAP_WL/18+PIN_WIDTH,-ENCAP_WL/2+0.7*PIN_X1,ENCAP_HEIGHT/2
K,105,-ENCAP_WL/2+ENCAP_WL/18,-ENCAP_WL/2+0.7*PIN_X1,ENCAP_HEIGHT/2+PIN_THICK

LSTR,100,101
LSTR,101,102
LSTR,102,103
LSTR,100,104
LSTR,100,105

K,1000,ENCAP_WL/2-0.7*PIN_X1,ENCAP_WL/2-ENCAP_WL/18,ENCAP_HEIGHT/2
K,1001,ENCAP_WL/2+0.3*PIN_X1,ENCAP_WL/2-ENCAP_WL/18,ENCAP_HEIGHT/2
K,1002,ENCAP_WL/2+0.4*PIN_X1,ENCAP_WL/2-ENCAP_WL/18,0
K,1003,ENCAP_WL/2+0.8*PIN_X1,ENCAP_WL/2-ENCAP_WL/18,0

k,1004,ENCAP_WL/2-0.7*PIN_X1,ENCAP_WL/2-ENCAP_WL/18-PIN_WIDTH,ENCAP_HEIGHT/2
K,1005,ENCAP_WL/2-0.7*PIN_X1,ENCAP_WL/2-ENCAP_WL/18,ENCAP_HEIGHT/2+PIN_THICK

LSTR,1000,1001
LSTR,1001,1002
LSTR,1002,1003
LSTR,1000,1004
LSTR,1000,1005

1。首先定義了一些基本的單元，內(nèi)部的是硅材質(zhì)的芯片，外面是封裝材料，在外圍的是兩根引腳，只是畫了線，沒有用腳本寫完
2。手動對線先面擴展，后是面到體的擴展，然后沿橫縱坐標(biāo)復(fù)制出其他引腳，最后生成整個結(jié)構(gòu)
3。再對結(jié)構(gòu)進(jìn)行網(wǎng)格劃分
4。對引腳施加DOF全約束
5。在x y z三個方向上施加重力加速度值分別使用的是10g
6。求解

求解過程中出現(xiàn)很多種類型的錯誤
*** ERROR ***                         CP =    166.750 TIME= 09:15:49
Sparse Matrix The solver has failed.  Please check the error file fodr
possible causes.

*** ERROR ***                         CP =    166.750 TIME= 09:15:49
Bisection may be activated if it is a nonlinear analysis.

*** ERROR ***                         CP =    170.328 TIME= 09:01:30
There is not enough memory for the Sparse Matrix solver to proceed.
Please increase the virtual memory on your system and/or increase the
work space memory and rerun ANSYS.  The memory currently allocated by
ANSYS = 764 MB.  The memory allocation attempted = 376 MB.  The
largest block of ANSYS memory available for the Sparse Matrix solver =
311 MB.

*** WARNING ***                      CP =    33.609 TIME= 08:56:12
Mid-nodes of some elements have been modified to lie on straight edges
because of distortion with the original mid-nodes.  This condition is
sometimes eliminated by tetrahedron element improvement when enabled.
Issue ESEL,,STRAIGHTENED to select such elements for listing or
plotting.

*** WARNING ***                      CP =    38.734 TIME= 08:56:24
Shape testing revealed that 1 of the 308131 new or modified elements
violate shape warning limits.  To review test results, please see the
output file or issue the CHECK command.

*** WARNING ***                      CP =    54.984 TIME= 08:57:44
Previous testing revealed that 1 of the 308131 selected elements
violate shape warning limits.  To review warning messages, please see
the output or error file, or issue the CHECK command.

*** ERROR *** --最核心的錯誤@@
A small negative equation solver pivot term has been encountered at the
UZ degree of freedom of node 2194.  Check for an insufficiently
constrained model.

我感覺還是前面部分建模部分或者是網(wǎng)格劃分還有約束的定義上出了問題，影響了后面結(jié)果的計算，請大家?guī)兔匆豢�，因為是初學(xué)，很多問題也許犯的很低級，請大家?guī)蛶兔Γx謝了�。。�！

[ Last edited by yangshuyin on 2010-11-16 at 11:08 ]

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