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研究A鍍銅液中B對(duì)銅還原和氧化過(guò)程的影響。用Hull槽測(cè)試陰極電流密度分布，通過(guò)電位掃描、循環(huán)伏安和交流阻抗曲線研究銅沉積的電化學(xué)行為，通過(guò)鍍液的吸光度測(cè)試和固體配合物的紅外光譜分析推斷配位化合物的形式。結(jié)果表明：B的加入能夠擴(kuò)大A鍍銅體系的陰極允許電流密度，對(duì)銅電沉積有阻化作用，促進(jìn)銅陽(yáng)極溶解，并可抑制氫氣的析出；隨著溶液中B濃度增加，在玻碳電極上發(fā)生的銅還原過(guò)程由電化學(xué)控制逐漸轉(zhuǎn)變?yōu)閿U(kuò)散控制。B的加入，主要是在A鍍銅體系中形成CuTEA(OH)2配位化合物，并吸附在電極表面而影響電化學(xué)反應(yīng)。 The effect of B on copper about reduction and oxidation process from a A electrolyte is investigated. Electrochemical measurements like cyclic voltammetry (CV),EIS and potentiodynamic polarization techinique are used to research the electrochemical behavior of copper deposition, the distribution of cathode current density is tested by hull cell, and also using the IR spectra of the complex and the Absorbance curves of the electrolyte to analysis and conclude the form of coordination compounds. The results showed that: the addition of B can expand A electrolyte cathode current density, inhibit the copper electrodeposition, promote the dissolution of copper anode, and can inhibit the liberation of hydrogen; the reduction process of copper control by electrochemical occurred at a glassy carbon electrode gradually transformed into diffusion control with the B concentration increasing in solution. The addition of B in A electrolyte mainly to form the CuTEA(OH)2 coordination compounds, and adsorb on the electrode surface to affect the electrochemical reaction. |
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zhingjw(金幣+10, 翻譯EPI+1): 謝謝幫我在時(shí)態(tài)上進(jìn)行改正！ 2011-03-15 21:00:58
| The effect of B on copper in the reduction and oxidation process in electrolyte A was investigated. Electrochemical measurements like cyclic voltammetry (CV),EIS and potentiodynamic polarization techinique were used to study the electrochemical behavior of copper deposition; the distribution of cathode current density was tested through hull cell; the IR spectra of the complex and the Absorbance curves of the electrolyte to analysis was used to characterise the coordination compounds. The results showed that: the addition of B could expand A electrolyte cathode current density, inhibit the copper electrodeposition, promote the dissolution of copper anode, and inhibit the liberation of hydrogen; the reduction process of copper control by electrochemical occurred at a glassy carbon electrode gradually transformed into diffusion control with the B concentration increasing in solution. The addition of B in electrolyte A was mainly to form the CuTEA(OH)2 coordination compounds, and to adsorb on the electrode surface to affect the electrochemical reaction. |
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