| 3 | 1/1 | 返回列表 |
| 查看: 725 | 回復(fù): 2 | |||
395676286木蟲(chóng) (著名寫(xiě)手)
|
[交流]
國(guó)際會(huì)議的委員會(huì) 大家認(rèn)識(shí)嗎 聽(tīng)過(guò)嗎 我比較孤陋寡聞 已有2人參與
|
|
一個(gè)國(guó)際會(huì)議的委員會(huì),我怎么都不認(rèn)識(shí),求高手指點(diǎn)。 Program Committee Xizhang chen, Jiangsu University, China Haiqing Si, Nanjing University of Aeronautics and Astronautics, China Meiqiang Cai, Zhejiang Gongshang University, China Zirong Zhou, Dongguan University of Technology, China Enrico Gregori, Institute of Informatics and Telematics, Italian National Research Council (CNR), Italy Shiwen Mao, Auburn University, USA Hanif D. Grado Sherali, Virginia Tech, USA George Athanasiou, University of Thessaly, Greece Ozgur Ercetin, Sabanci University, Turkey Svilen Ivanov, University of Magdeburg, Germany John C. S. Lui, Chinese University of Hong Kong, Shatin, Hong Kong, Hong Kong Hwangnam Kim, Korea University, Korea, Jun Zou, McMaster University, Canada Shafiullah Khan, Brunel University, United Kingdom Sung-Ta Tsai, National Chengchi University, Taiwan Luciano Lenzini, University of Pisa, Italy Hassanein Hossam, Queens University, Canada Sirisha Medidi, Boise State University, USA Yajun Li, Shanghai Jiao Tong University, China Rongbo Zhu, South-Central University for Nationalities, China Yuan Lin, Norwegian University of Science and Technology, Norwegian Jianxin Chen, University of Vigo, Spain Hui Wang, University of Evry in France, France Xiyin Wang, Hebei Polytechnic University, China Dianxuan Gong, Hebei Polytechnic University, China Chunxiao Yu, Yanshan University, China Yanbin Sun, Beijing University of Posts and Telecommunications, China Mingyi Gao, National Institute of AIST, Japan Guofu Gui, CMC Corporation, China Haiyong Bao, Fuji Xerox Co., Ltd., Japan Xiwen Hu, Wuhan University of Technology, China Mengze Liao, Cisco China R&D Center, China Yangwen Zou, Apple China Co., Ltd., China Yajun Guo, Huazhong Normal University, China Liang Zhou, ENSTA-ParisTech, France Xi Zhang, Texas A&M University, USA Weihua Zhuang, University of Waterloo, Canada Jayesh Seshadri, University of Texas at Austin, USA Pan Li, Mississippi State University, USA Cheng Li, Memorial University, Canada Nael Abu-Ghazaleh, State University of New York at Binghamton, USA Yang Xiao, University of Alabama, USA Abd-Elhamid Taha, Queen's University, Canada Michele Rossi, University of Padova, Italy Venkatesha Prasad, Delft University of Technology, Netherlands Mina Guirguis, Texas State University, USA Nils Aschenbruck, University of Bonn, Germany Ragip Kurceren, Nokia Research, USA Haining Wang, College of William and Marry, USA Onur Altintas, Toyota InfoTechnology Center, Japan Suresh Subramaniam, George Washington University, USA Dominic Shupke, Nokia Seimens, Germany Abdallah Shami, University of Western Ontario, Canada Dimitri Androutsos, Ryerson University, Canada Muhammad Jamil Anwas, Lahore University of Management Science Lahore, Pakistan Mian Muhammad Awais, Lahore University of Management Science Lahore, Pakistan Ing. Vitoantonio Bevilacqua, Polytechnic of Bari, Italy Tim. B. Littler, Queen’s university Belfast, UK Jinde Cao, Southeast University, China Wenming Cao, Zhejiang University of Technology, China Dechang Chen, Uniformed Services University of the Health Sciences, USA Mei-Ching Chen, Tatung University, Taiwan Rong-Chang Chen, National Taichung Institite of Technology, Taiwan Chi-Cheng Cheng, National Sun Yat-Sen University, Taiwan Ziping Chiang, Leader University, Taiwan Key-Sun Choi, Korea Advanced Institute of Science and Technology, Korea Daniel Coca, The University of Sheffield, UK Du-Wu Cui, Xi’an University of Technology, China Donald C. Wunsch, University of Missouri – Rolla, USA Minrui Fei, Shanghai University, China John Q Gan, University of Essex, UK Michael Granitzer, Know-Center Graz, Austria Saeed Hashemi, Tehran University, Canada Marko Ho?evar, University of Ljubljana, Slovenia Jiankun Hu, RMIT University, Australia Zhao-Hui Jiang, Hiroshima Institute of Technology, Japan Michael J.Watts, Lincoln University, New Zealand Tai-hoon Kim,Defense Security Command,Korea Seong G. Kong, The University of Tennessee USA Worapoj Kreesuradej, King Mongkut’s Institute of Technology Ladkrabang, Thailand Haibing Yin, Peking University, China Yanliang Jin, Shanghai University, China Z.Q.Zhao, Shanxi University of Traditional Chinese Medicine |
至尊木蟲(chóng) (文壇精英)
IEEE雜志與會(huì)議專(zhuān)家
鐵蟲(chóng) (初入文壇)

| 3 | 1/1 | 返回列表 |
| 最具人氣熱帖推薦 [查看全部] | 作者 | 回/看 | 最后發(fā)表 | |
|---|---|---|---|---|
|
[考研] 一志愿 南京航空航天大學(xué)大學(xué) ,080500材料科學(xué)與工程學(xué)碩 +3 | @taotao 2026-03-20 | 3/150 |
|
|---|---|---|---|---|
|
[考研] 294求調(diào)劑材料與化工專(zhuān)碩 +14 | 陌の森林 2026-03-18 | 14/700 |
|
|
[考研] 296求調(diào)劑 +3 | www_q 2026-03-18 | 6/300 |
|
|
[考研] 復(fù)試調(diào)劑 +4 | z1z2z3879 2026-03-14 | 6/300 |
|
|
[考博] 東華理工大學(xué)化材專(zhuān)業(yè)26屆碩士博士申請(qǐng) +8 | zlingli 2026-03-13 | 8/400 |
|
|
[考研] 一志愿天津大學(xué)化學(xué)工藝專(zhuān)業(yè)(081702)315分求調(diào)劑 +11 | yangfz 2026-03-17 | 11/550 |
|
|
[考研] 346求調(diào)劑[0856] +3 | WayneLim327 2026-03-16 | 6/300 |
|
|
[考研] 一志愿中海洋材料工程專(zhuān)碩330分求調(diào)劑 +7 | 小材化本科 2026-03-18 | 7/350 |
|
|
[考研] 一志愿武理材料305分求調(diào)劑 +5 | 想上岸的鯉魚(yú) 2026-03-18 | 6/300 |
|
|
[考研] 295求調(diào)劑 +3 | 一志愿京區(qū)211 2026-03-18 | 5/250 |
|
|
[考研] 085600材料與化工 +5 | 安全上岸! 2026-03-16 | 5/250 |
|
|
[考研] 環(huán)境工程調(diào)劑 +8 | 大可digkids 2026-03-16 | 8/400 |
|
|
[考研] 考研化學(xué)學(xué)碩調(diào)劑,一志愿985 +4 | 張vvvv 2026-03-15 | 6/300 |
|
|
[考研] 有沒(méi)有道鐵/土木的想調(diào)劑南林,給自己招師弟中~ +3 | TqlXswl 2026-03-16 | 7/350 |
|
|
[考研] 278求調(diào)劑 +3 | Yy7400 2026-03-13 | 3/150 |
|
|
[考研] 318求調(diào)劑 +3 | Yanyali 2026-03-15 | 3/150 |
|
|
[考研] 326求調(diào)劑 +3 | mlpqaz03 2026-03-15 | 3/150 |
|
|
[考研] 中科大材料專(zhuān)碩319求調(diào)劑 +3 | 孟鑫材料 2026-03-13 | 3/150 |
|
|
[考研] 330求調(diào)劑 +3 | ?醬給調(diào)劑跪了 2026-03-13 | 3/150 |
|
|
[考研] 266求調(diào)劑 +4 | 學(xué)員97LZgn 2026-03-13 | 4/200 |
|