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[資源]
現(xiàn)代電鍍(第五版)英語原版
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1 Fundamental Considerations (Milan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder). 2 鍍銅 (Jack W. Dini and Dexter D. Snyder). 3 鍍鎳 (George A. Di Bari). 4 鍍金 (Paul A. Kohl). 5 化學鍍和電鍍銀 (Mordechay Schlesinger). 6 Tin and Tin Alloys for Lead-Free Solder (Yun Zhang). 7 鍍鉻(Nenad V. Mandich and Donald L. Snyder). 8 鍍鉛和鉛合金 (Manfred Jordan). 9 鍍錫和錫合金 (Manfred Jordan). 10 鍍鋅和鋅合金(Ren Winand). 11 鍍鐵和鐵合金s (Masanobu Izaki). 12 鍍鈀 (Joseph A. Abys). 13 Electrochemical Deposition Process for ULSI Interconnection Devices (Tetsuya Osaka and Masahiro Yoshino). 14 半導體電鍍 (T. E. Schlesinger, K. Rajeshwar, and N. R. De Tacconi). 15 非金屬電鍍 (Mordechay Schlesinger). 16 Conductive Polymers: Electroplating of Organic Films (Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma). 17 化學鍍銅 (Milan Paunovic). 18 化學鍍鎳 (Mordechay Schlesinger). 19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems (Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka). 20 化學鍍鈀和鉑 (Izumi Ohno). 21 化學鍍金 (Yutaka Okinaka and Masaru Kato). 22 化學鍍合金 (Izumi Ohno). 23 Preparation for Deposition (Dexter D. Snyder). 24 Manufacturing Tools (Tom Ritzdorf). 25 Monitoring and Control (Tom Ritzdorf). 26 Environmental Aspects of Electrodeposition (Micha Tomkiewicz). 27 Applications to Magnetic Recording and Microelectronic Technologies (Stanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov). 28 Microelectromechanical Systems (Giovanni Zangari). 29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques (Xianying Meng-Burany). 30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates (R. Petro, M. Schlesinger, and Guang-Ling Song). |
鋰電資源共享 | 萬卷閣之搜神記 | 淘貼淘寶 | 電化學、材料模擬、金屬材料及各大材料 |
科技 | material science | 學習外語書籍 | 科技ok |
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