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ybin536913金蟲(chóng) (小有名氣)
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[求助]
銅合金 摘要翻譯--求好心人幫幫忙
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Cu-Cr系(Cr<1.2wt%)合金因其具有優(yōu)良的導(dǎo)電性和較高的強(qiáng)度被廣泛用于電力、電子行業(yè),比如高壓開(kāi)關(guān)中的觸頭材料、接觸導(dǎo)線等。Cu-Cr系合金是析出強(qiáng)化型銅合金的主要代表之一。但Cr-Cu固溶性差、熔點(diǎn)相差約800℃、高溫熔煉均勻性差、能耗高;Ni元素能無(wú)限固溶于Cu中形成α固溶體;Cr-Ni合金共晶溫度比Cr降低約500℃以其中間合金加入Cu基體可顯著降低Cu-Cr合金的熔煉溫度,改善合金的組織性能并減低能耗。 為此,本文擬在銅中引入Cr-Ni中間合金,依據(jù)Cr-Ni合金相圖共晶點(diǎn)二者質(zhì)量分?jǐn)?shù)比,以此為指導(dǎo)制備出Cu-0.3(Cr44Ni)和Cu-0.5(Cr44Ni)兩種合金(分別命名為a、b合金)。采用硬度試驗(yàn)、拉伸試驗(yàn)、電阻測(cè)試,光學(xué)顯微鏡(OM)、掃描電鏡(SEM)、X射線衍射(XRD)及透射電鏡(TEM)等分析,對(duì)Cu-0.3(Cr44Ni)和Cu-0.5(Cr44Ni)合金的軋制變形加工硬化及退火軟化行為、時(shí)效行為、固溶時(shí)效加工硬化行為等進(jìn)行了系統(tǒng)研究,研究結(jié)果表明: 1. a、b合金經(jīng)1000℃/1h固溶處理后形成完全固溶體,硬度分別為67.3、75.5HV,相較于Cu的硬度提升了30%,有一定的固溶強(qiáng)化效應(yīng);a、b固溶合金經(jīng)不同溫度和時(shí)間時(shí)效處理后,在450℃/1h時(shí)效時(shí)達(dá)到峰值硬度分別為138、152HV,比固溶態(tài)合金的提高約100%。表明合金經(jīng)固溶-時(shí)效處理后,時(shí)效強(qiáng)化效果顯著;軋制變形對(duì)時(shí)效行為的影響表明,變形對(duì)時(shí)效強(qiáng)化效果影響不大,但在變形量達(dá)到75%后、時(shí)效時(shí)間顯著縮短。 2. 軋制變形量約60%時(shí)a合金加工硬化高于b合金、變形量大于60%時(shí)b合金加工硬化高于a合金,當(dāng)a、b合金變形量分別達(dá)60、75%時(shí)達(dá)到峰值硬度(分別為123.7、132HV)顯著高于固溶態(tài)硬度而明顯低于時(shí)效硬度;固溶加工硬化達(dá)峰值硬度的a、b合金經(jīng)300~700℃/1h退火后的硬度變化表明450℃/1h以下退火對(duì)加工硬化影響不大、合金有很好的抗回復(fù)軟化抗力。a、b合金分別在600、650℃時(shí)完成再結(jié)晶過(guò)程,使銅再結(jié)晶溫度提高200℃以上。 3. 時(shí)效處理對(duì)固溶加工硬化影響表明b合金的加工硬化均高于a合金,達(dá)到峰值硬度的形變量與固溶加工硬化相同,但峰值硬度(分別為163.5、184HV)顯著高于其它幾種工藝條件處理后的硬度;固溶時(shí)效加工硬化達(dá)峰值硬度的a、b合金經(jīng)300~700℃/1h退火后的硬度變化表明350℃/1h以下退火硬度不變,但塑性和導(dǎo)電性可以得到明顯提高。 4. a、b兩合金經(jīng)1000℃/1h固溶水淬-450/1h時(shí)效-75%變形后抗拉強(qiáng)分別為425、446MPa,電導(dǎo)率分別為74.7、70.1%IACS,延伸率分別為2.4、3.1%;固溶-時(shí)效-變形后的a、b合金經(jīng)350℃保溫1h時(shí)強(qiáng)度強(qiáng)度仍達(dá)348、378MPa、延伸率提升到8.0、9.7%,電導(dǎo)率分別達(dá)88.4、83.7%IACS。 綜合以上研究結(jié)果可知,Cu-x(Cr44Ni)合金經(jīng)過(guò)固溶-時(shí)效-變形-低溫回復(fù)處理后,可以實(shí)現(xiàn)高強(qiáng)度、高塑性與高導(dǎo)電性的統(tǒng)一,有較好的應(yīng)用開(kāi)發(fā)價(jià)值。 |
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Cu-Cr-based (Cr <1.2wt%) alloys are widely used in electrical and electronic industries, such as the contact material and the contact wires in high-voltage switches because of its excellent electrical conductivity and high strength . Cu-Cr-based (Cr <1.2wt%) alloys are one of the main representatives of in precipitated fortified copper alloys . however, Cu-Cr alloys also have some drawbacks including poor Cr-Cu solid solution, melting point difference of approximately 800 ℃, poor high temperature melting uniformity and high energy consumption; Ni element can solid solute infinitely into Cu to form the α solid solution; The eutectic temperature of Cr-Ni alloys is 500 ℃ lower than that of Cr since the adding of Cu matrix into intermediate alloys can significantly reduce the melting temperature of Cu-Cr alloy and improve organizational performance and reduce energy consumption of the alloys. Therefore, in this article , the authors are intended to introduce Cr-Ni intermediate alloys into Cu , then prepare two alloys of Cu-0.3 (Cr44Ni) and Cu-0.5 (Cr44Ni) which will be referred to as a, b alloys herein, respectively, based on the Cr-Ni alloy phase diagram eutectic point mass ratio between the two elements as a guideline. Assays including hardness test, tensile test, resistance test, optical microscope (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and transmission electron microscopy (TEM) had been used to perform systematical analysis on rolling deformation hardening, annealing softening behavior, aging behavior and solid solution aging hardening behavior in the Cu-0.3 (Cr44Ni) and Cu-0.5 (Cr44Ni) alloys, the study results had demonstrate: 1. A and b alloys will from a complete solid solution after 1000 ℃ / 1h solid solution with a hardness of 67.3 and 75.5 HV, respectively ; Hardness is 30% higher than that of Cu concomitant with some solid solution fortifying effects; at the 450℃/1h, a and b solid solution alloy under different temperature and aging treatment can reach the peak hardness of 138 and 152 HV, respectively, which are approximately 100% higher than that of the solid solution alloy. Significant aging fortifying effects were demonstrated in solid solution - aging treated alloys ; the effects of rolling deformation on aging behavior suggested that deformation has little effect on the aging fortifying effects, but aging time was significantly shortened after a 75% of deformation has been reached . 2. At a rolling deformation of about 60%, alloy a has a hardness higher than that of alloy b; at a deformation greater than 60% ,alloy a has a hardness higher than that of alloy b, alloy a and b reached peak hardness of 123.7 and 132HV at alloy deformation of 60 % and 75% ,respectively ,which was significantly higher than the hardness of solid solution and significantly lower than aging hardness; solid solution hardening alloys a and b can reach peak hardness under 300 ~ 700 ℃ / 1h annealing, which indicates that annealing conducted below 450 ℃ / 1h had little effect on hardening process and alloy has appropriate anti - softening resistance. Alloy a and b had accomplished recrystallization at 600℃ and 650 ℃,respectively, which had raised the recrystallization temperature of copper for 200 ℃. 3. Aging treatment effect on solution hardening showed the alloy b had a higher hardening than alloy a, and the deformation with peak hardness is the same as solution, but the peak hardness (163.5,184 HV, respectively) was significantly higher than the hardness from several other processes; solid solution hardening alloys a and b can reach peak hardness under 300 ~ 700 ℃ / 1h annealing , which is associated with a constant hardness under annealing below 350℃/1h , but the ductility and conductivity can be significantly improved. 4. Alloy a and b had tensile strength of 425 and 446MPa with 1000 ℃ / 1h solid solution water quench -450/1h aging plus 75% deformation, and the conductivity were 74.7 and 70.1% IACS, respectively; the elongation were 2.4 and 3.1 % , respectively; For the solid solution - aging - deformation treated alloys a and b , the strength still reached up to 348 and 378 MPa, elongation had improved to 8.0 and 9.7%; conductivity were of 88.4、83.7% IACS , respectively . Based on the above results we conclude that the solid solution - aging - deformation -Low temperature back treated Cu-x(Cr44Ni) can achieve the combination of high strength, high ductility and high electrical conductivity , thus ,there is a good application prospect. |
金蟲(chóng) (小有名氣)
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