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[求助]
漢譯英 求潤色，謝謝。
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本文采用等離子噴涂和電沉積兩種工藝在Fe基體上沉積Zn涂層，研究了界面微觀阻尼和涂層厚度對阻尼性能和動態(tài)模量的影響，并對電沉積Zn/Fe涂層系統(tǒng)進(jìn)行了熱處理，進(jìn)一步研究了元素擴(kuò)散對阻尼性能的影響。結(jié)果表明：系統(tǒng)阻尼值的大小與厚度比的關(guān)系不大。等離子涂層系統(tǒng)的缺陷率越大時，阻尼峰值越大，阻尼峰值與缺陷率可用關(guān)系式QP = 1.5+ 5.0/ (1+(D/0.2)5)表示，而動態(tài)模量則隨著缺陷率的增加有逐漸降低的趨勢。 In this paper, the Zn coatings were prepared onto the Fe substrate by air plasma spray process and electro-deposition technology respectively, and the effect of interfacial microstructure and coating thickness on the damping and dynamic modulus was studied, and electro-deposited Zn/Fe coating system was heated treatment, the effects of element diffusion on damping properties was further studied. The results indicated that: the effect of thickness ratio on system damping was small. The lager defect rate of plasma spray was corresponding to the greater damping-peak (with fitted line of QP = 1.5 + 5.0 / (1 + (D/0.2) 5)), while the dynamic modulus gradually decreased with the increasing defect rate. |
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【答案】應(yīng)助回帖
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RXMCDM: 金幣+1, 多謝應(yīng)助！ 2014-07-16 14:39:02
wxqtjw: 金幣+15, ★★★很有幫助 2014-07-17 11:00:54
wxqtjw: 金幣+15, 翻譯EPI+1 2014-07-17 13:57:25
RXMCDM: 金幣+1, 多謝應(yīng)助！ 2014-07-16 14:39:02
wxqtjw: 金幣+15, ★★★很有幫助 2014-07-17 11:00:54
wxqtjw: 金幣+15, 翻譯EPI+1 2014-07-17 13:57:25
In this paper, plasma spraying and electrodeposited were applied to make nickel coating be deposited on a copper substrate,the effects of interfacial microstructure damping and the coating thickness on damping properties and dynamic modulus have been studied,in addition to,Electrodeposited Ni / Cu coating system has been heated to research the effects of element diffusion on damping performance.The results have showed that the relationship of the system damping values and thickness ratio was unobvious.When the defect rate of plasma coating system is higer,the greater damping peak values will appear.The relationship formula of damping peak value and defect rate is QP = 1.5+ 5.0/ (1+(D/0.2)5),meanwhile the gradually decreasing trend of dynamic modulus has been found when the defect rate is increasing. |
2樓2014-07-16 13:50:52
3樓2014-07-16 13:51:58
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