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wangcody木蟲 (小有名氣)
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[交流]
第一篇文章等了3個(gè)月的審稿意見，怎么修改，還有戲嗎？急急急！跪求指點(diǎn)。
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Reviewer(s)' Comments to Author: Referee: 1 Comments to the Author This paper reports the preparation of a poly(propylene fumarate) (PPF) -based polymer. The polymer is prepared by radical polymerization of PPF and PPF-diacrylate (PPF-DA) macromers under UV radiation. The authors claim that this polymer is suitable for LED encapsulants due to its high transparency (90%), high refractive index (n = 1.54) and good thermal properties (stable below 270 °C). The paper is original within the reviewer’s knowledge. However, after comparing with a current LED encapsulant solution - silicone, the reviewer does not think that the polymer reported in this paper present advantages over the current solution. Comparing with commercially available silicone products, for example, Dow Corning® Silicone Optical Encapsulant (abbreviated as “silicone” below) [1]: 1. Transparency: one of the most important characteristic of an LED encapsulant is its transparency. Silicone has a transparency of greater than 99% at 450 nm, 1 mm thick; while the reported polymer only has a transparency of 90%. A 10%-absorption is non-trivial in LED applications. 2. Refractive index: Phenyl silicone has a refractive index of 1.53 – 1.54; the reported polymer has a refractive index of 1.54. 3. Thermal stability: Silicone has an operational temperature range of -45 to 200 °C; the reported polymer does have a higher maximum operational temperature (270 °C). However, given the fact that current LED chips usually have a maximum operating temperature around 150 °C [2], better thermal stability at a temperature that is higher than 200 °C does not provide any practical benefits. Thus, the reviewer would not suggest the publication of this paper. Reference: [1] http://www.dowcorning.com/applic ... tk=ProductFinder_en [2] http://www.cree.com/xlamp_app_notes/thermal_management Referee: 2 Comments to the Author LED encapsulant is one of critical components in LED packaging. Epoxy or silicone base resins have been used used in industry. In this article, the author introduced poly(propylene fumarate based resin encapsulant and analyzed it's material property as an alternative. Co-polymer between PPF and PPF-DA has been used as a base material. The result showes promising optical property and thermo-mechanical properties, thus, indicating that PPF and PPF-DA polymeric material can be a good candidate for LED encapsulation. Overall it is an interesting article for both industry and academia but there is a couple of comments need to be addressed to make the manuscript more beneficial. 1. In the introduction part, the author mentioned about bio-compatible and environment-friendly degradability of PPF as one of it's advantage. However, as a LED encapsulant material, it has to survive through extreme external environmental conditions. So I recommend the authors to rephrase it more carefully. For instance, upon the copolymerization with PPF-DA, how it forms thermoset polymeric structure and it's corresponding mechanical properties. 2. Light transmittance. The result shows transmittance of 90% in visible light but many commercially available material shows higher than 98%. Is there a way to improve the transmittance? 3. Thermal stability. The author applied temperature scan upto 1000C. It is one of ways to show thermal stability of thermoset resin; however, more effective ways (used in industry) is to store the resin at 150C for a long period of time (i.e. 250hr or 500hr) and compare it's light transmittance changes before/after. The result will demonstrate the degree of deterioration and yellowing of materials. 4. Any residual heat of reaction. The manuscript does not show the degree of completion of the reaction. It is very important to achieve high reaction conversion because any unreacted functional groups in the polymeric network have potential to alter the material properties (modulus, adhesion, refractive index, etc.) later once they have chance to resume reaction. It is highly recommended to include DSC analysis. For instance, 1st temperature scan showing the heat of reaction and followed by 2nd temp. scan to verify any residual heat of reaction. Referee: 3 Comments to the Author A novel UV-crosslinkable poly(propylene fumarate) (PPF) based polymer composite with good thermal stability and high refractive index (n=1.54) was explored, which can be used for encapsulation of light emitting diodes (LEDs). Polymer composite have been prepared by radical polymerization using PPF and poly(propylene fumarate)-diacrylate (PPF-DA) macromers. Detailed measurement, include thermal gravity analysis, refractive index, transparency and mechanical properties (bonding strength and tensile-shear strength) of the polymer composite with different PPF/PPF-DA ratio, have been provided and proved its suitability for encapsulation of LEDs. There is one problem: Part 2.4, paragraph 2: “The bonding strengths of …… was found to be significantly stronger than ……. However, no significant difference was found in the bonding strengths among …….” The content makes confusion. |
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2樓2015-04-14 10:03:55
wangcody
木蟲 (小有名氣)
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編輯開頭的一段話： Thank you for your submission to RSC Advances. Again, please accept my apologies for the delay in returning a decision on this manuscript. This was due to the initial information provided that the was a resubmission of a previously submitted manuscript, which delayed the initial review stages, followed by further delays due to the need to obtain a third adjudicative report in order to come to an informed decision. We have now received all the reviewers’ reports on your manuscript, which are copied below. The reviewers feel that some modifications are necessary before publication can be considered. However providing that the comments of the reviewers are addressed in full I will be pleased to consider a revised manuscript. The manuscript will be subject to further peer review prior to reaching a final decision on acceptance. |
3樓2015-04-14 10:07:21
wangcody
木蟲 (小有名氣)
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編輯開頭的一段話如下： Thank you for your submission to RSC. Again, please accept my apologies for the delay in returning a decision on this manuscript. This was due to the initial information provided that the was a resubmission of a previously submitted manuscript, which delayed the initial review stages, followed by further delays due to the need to obtain a third adjudicative report in order to come to an informed decision. We have now received all the reviewers’ reports on your manuscript, which are copied below. The reviewers feel that some modifications are necessary before publication can be considered. However providing that the comments of the reviewers are addressed in full I will be pleased to consider a revised manuscript. The manuscript will be subject to further peer review prior to reaching a final decision on acceptance. |
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chenbaorui
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9樓2015-04-14 14:33:16
wangcody
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10樓2015-04-14 14:45:04
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