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[交流] 【工學】【2011-05-10】2011年機電一體化與材料加工國際會議(ICMMP2011)—SCI、EI收錄

2011 International Conference on Mechatronics and Materials Processing
2011年機電一體化與材料加工國際會議(ICMMP 2011)
2011年11月18日—20日；中國廣州

https://www.icmmp.org

主辦單位：澳大利亞新南威爾士大學；浙江大學；西安交通大學；香港理工大學；廣州大學

大會主席：Liangchi Zhang院士，澳大利亞工程院院士、新南威爾士大學Scientia教授和終身教授

大會聯(lián)合主席：陳子辰教授，浙江大學

征文通知

2011年機電一體化與材料加工國際會議(ICMMP 2011)將于2011年11月18日—20日在中國廣州召開。會議主題包括材料科學與技術、制造技術與加工工藝、機電一體化與自動化、工程教育與培訓等。會議內(nèi)容涵蓋了機電一體化與材料加工領域的主要研究方向，會議旨在為全世界機電一體化與材料加工領域的專家、學者和專業(yè)技術人員提供一個交流最新研究成果的機會。熱忱歡迎從事機電一體化與材料加工技術研究的專家、學者和專業(yè)技術人員踴躍投稿并參加大會。
本次會議經(jīng)同行專家評審錄用的論文將全部出版在國際期刊《Advanced Materials Research》上，在該刊物上發(fā)表的論文將全部被EI Compendex和ISTP收錄。100多篇優(yōu)秀的論文將推薦到下列SCI收錄的國際期刊上發(fā)表：
Materials and Manufacturing Processes
Surface Engineering
Surface Science and Engineering
Advanced Science Letters

征文要求

會議語言為英語，請務必用英語撰寫論文。所投論文應在國內(nèi)外未曾公開發(fā)表過，在理論或應用方面有創(chuàng)見。論文須嚴格按《Advanced Materials Research》的要求撰寫（格式模板文件見會議網(wǎng)址：https://www.icmmp.org）。投稿時請同時提交論文的MS Word版本及PDF版本。

論文全文提交方式：通過E-mail以郵件附件的形式將你的論文全文以及填寫完畢的論文登記表提交給組委會（icmmpx@gmail.com）。本會議無需提前投摘要。

重要日期

論文全文提交截止日期：          2011年5月10日
論文錄用通知日期：                2011年6月10日
修改論文提交與注冊截止日期：2011年7月1日
會議時間：                            2011年11月18日—20日

會議注冊

每篇錄用論文必須注冊方可發(fā)表。注冊費為2600元人民幣/篇或400美元/篇。如論文超過4頁，每超1頁需另加300元人民幣或50美元。每篇錄用論文至少一名作者注冊，方可發(fā)表。以第一作者身份投多篇論文，從第二篇起論文注冊費降為2300元。如果論文被推薦到SCI收錄期刊上發(fā)表，則需要交納額外的出版費。

聯(lián)系方式
E-mail: icmmpx@gmail.com（推薦采用）
網(wǎng)址：https://www.icmmp.org
電話: +86 20 3936 6470
地址：廣州市大學城外環(huán)西路230號廣州大學機械與電氣工程學院ICMMP2011組委會，  510006

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2011 International Conference on Mechatronics and Materials Processing (ICMMP 2011)
November 18-20 2011,GuangzhouChina

https://www.icmmp.org

Call for Papers

2011 International Conference on Mechatronics and Materials Processing (ICMMP2011)will be held during November 18-20, 2011, inGuangzhou,China.ICMMP2011 aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Mechatronics and Materials Processing. All accepted papers will be published in international journal "Advanced Materials Research" [ISSN:1022-6680, Trans Tech Publications] and will be indexed in the major academic databases, includingEI Compendex, Thomson ISI (ISTP),and other indexing services(See TTP's Conference List). The full text is online available via platformwww.scientific.net. Trans Tech Publicationswill provideonline camera-ready paper submission system.Over 100 selected excellent papers will be published in SCI-indexed journals:Materials and Manufacturing Processes (Taylor & Francis),Surface Engineering (Maney Publishing),Surface Science and Engineering, Advanced Science Letters(American Scientific Publishers).

Topics of interest include, but are not limited to:
(I) Material Science and Technology
(01) Nanomaterials
(02) Composites and polymer materials
(03) Biomaterials
(04) Semi-conductor and micro-electronic materials
(05) Smart/Intelligent Materials/Intelligent Systems
(06) Thin Films
(07) New Functional Materials
(08) Metal alloy materials
(09) Iron and Steel
(10) Building Materials
(11) Materials forming
(12) Coatings and surface engineering
(13) Materials Characterization
(14) Mechanical Behavior & Fracture
(15) Testing and Evaluation of Materials
(II)  Manufacturing Technology and Processing
(16) Modeling, analysis and simulation of manufacturing processes
(17) High-speed/precision machining
(18) CAD/CAM/ CAE
(19) Virtual manufacturing and concurrent engineering
(20) Green design and manufacturing
(21) Digital and agile manufacturing
(22) PDM, ERP, logistics and supply chain
(23) Bionic mechanisms and bio-manufacturing
(24) Tribology in Manufacturing Processes
(25) Integrated Manufacturing System
(26) Laser Processing Technology
(27) Materials Machining
(28) Micro- and nano-fabrication, materials processing and technology
(29) Thermal Engineering Theory and Applications
(30) Testing, measuring, monitoring and controlling of manufacturing processes
(31) Engineering Optimization
(32) Product Design and Development
(33) Project/Engineering Management
(III) Mechatronics and Automation
(34) Mechatronics
(35) Industrial Robotics and Automation
(36) Intelligent control, neuro-control, fuzzy control
(37) Industrial Automation and Process Control
(38) Distributed Control System
(39) Embedded System
(40) Control system modeling and simulation techniques
(41)Enterprise Informationization and information processing technology
(42)Virtual Instrumentation
(43)Sensors, multi-sensor data fusion algorithms
(44)Advanced measurement and Machine Vision system
(45)Transmission and control of Fluid
(46)Dynamics, Vibration and Control
(IV)  Engineering Education and Training
(47) Engineering education and training
(V)  Other related topics
(48)  Other related topics

Paper Submission

All papers must be written in English. Please prepare your paper in strict accordance with the format available at the conference website (https://www.icmmp.org). And submit your papers and the filed Paper Submission Form by email attachment to the ICMMP2011 Conference organizer (icmmpx@gmail.com)by the given deadline. All papers should beno less than 4 pagesin length and shorter papers should not be included in the journal. Document file in PDF and MS Word format are both required when submitting your papers.

Important Dates(Deadline)

Submission of full Papers：                         May 10, 2011
Notification of Papers Acceptance：             June 10, 2011
Camera Ready Submission and Registration：July 1, 2011
Conference：                                              November 18-20, 2011

Registration

The registration fee is 400 U.S. Dollars or 2600 RMB for each paper (over 4 pages extra-charge 50 U.S. Dollars or 300 RMB per page needs to be paid). Only one paper can be included into the journal by paying one registration fee; you can pay Extra Paper Charges (2300 RMB or 350 U.S. Dollars) for one more paper from the same first author who already has a paid registration. Extra-charge for Papers, which will be published in SCI-indexed journals, needs to be paid.

Sponsors

TheUniversityofNew South Wales,Australia
Zhejiang University, China
Xi’anJiaotong University,China
TheHong KongPolytechnicUniversity,Hong Kong
Guangzhou University,China
Trans Tech Publications Inc.
Materials and Manufacturing Processes (Taylor & Francis)
Surface Engineering (Maney Publishing)
Advanced Science Letters (American Scientific Publishers)

Contact Information
E-mail: icmmpx@gmail.com
Website: https://www.icmmp.org
Tel: +86 20 3936 6470
School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China

[ Last edited by icmea on 2011-2-10 at 18:30 ]

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