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zhingjw金蟲 (小有名氣)
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[求助]
求助翻譯一段摘要，非常感謝
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| 為了解決A在表面電鍍過程中晶間富釹相易被電解液腐蝕的問題，我們提出A經(jīng)過磷化和鍍銅雙重涂層保護(hù)技術(shù)，也就是：先讓A的晶間相通過磷化工藝生成鈍態(tài)的磷化產(chǎn)物，然后在這基礎(chǔ)上進(jìn)行堿性鍍銅。分別采用SEM和電化學(xué)方法觀察了磷化后A的表面形貌和耐腐蝕性能。結(jié)合EDS分析結(jié)果，討論了磷化膜的形成機(jī)理。對(duì)短時(shí)間磷化并鍍銅的A進(jìn)行斷面觀察和耐蝕分析。結(jié)果表明：A的晶間相比主晶相優(yōu)先形成磷化產(chǎn)物；在短時(shí)間磷化后，A的晶間相就覆蓋磷化產(chǎn)物，并使磁體的耐蝕性獲得明顯提高。磷化產(chǎn)物主要是釹和鐵的磷酸鹽產(chǎn)物，并可能有釹氧化物，并且晶間相磷化膜的Nd含量要高于主晶相。A通過晶間磷化再電沉積銅的協(xié)同保護(hù)下，耐蝕性顯著優(yōu)于單獨(dú)磷化膜或單獨(dú)鍍層保護(hù)。 |
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【答案】應(yīng)助回帖
★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ★ ...
phu_grassman: 金幣+5, thanks for your kind help. 2013-02-27 13:31:17
zhingjw: 金幣+50, 翻譯EPI+1, ★★★★★最佳答案, 謝謝 2013-02-28 00:57:19
phu_grassman: 金幣+5, thanks for your kind help. 2013-02-27 13:31:17
zhingjw: 金幣+50, 翻譯EPI+1, ★★★★★最佳答案, 謝謝 2013-02-28 00:57:19
To solve the susceptibility of A's intergranular Nd-rich phase to electrolytic corrosion during surface electroplating, we proposed a double coating protection technique for A including phosphorization and copper plating, in other words, the A's intergranular phase is allowed to generate passive phosphorization products through phosphorizing process, folllowed by alkaline copper plating. The surface topography and corrosion resistance of the phosphorized A were observed using SEM and electrochemical method respectively. Based on the above data as well as EDS analysis results, the formation mechanism of the phosphorized film was discussed. For A that has been phosphorized and copper plated for a short time, sectional examination and corrosion resistance analysis were done. The results indicate that, the intergranular phase of A forms the phosphorization products preferably than the main crystal phase of A; just after a short time phosphorization, the A's intergranular phase has covered the phosphorization product and enabled the corrosion resistance of the magnetic body significantly improved. The main phosphorization products are Nd and Fe phosphates, and probably Nd oxides, and Nd content of the intergranular phase's phosphorized film is higher than that of the main crystal phase. With synergistic protection of A through intergranular phosphorization followed by copper electrodeposition, its corrosion resistance is significantly better than that with a single phosphorized film or single plating protection.  |
2樓2013-02-27 11:33:12
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