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gao26gao新蟲 (初入文壇)
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[求助]
求助，大家可以幫忙把這段中文翻譯成英文嗎？
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SECC 電解板 材質(zhì)和性能與SPCC相同 材料表面增加了鍍鋅層，起到表面防護(hù)作用，但不具備焊錫功能，采用沖壓工藝制作沖壓斷面沒有保護(hù)層，在自然環(huán)境中會(huì)發(fā)生氧化現(xiàn)象。 SPCC 單光板 是冷軋板的一種。材質(zhì)為優(yōu)質(zhì)的碳素鋼，其有良好的機(jī)械性能和沖壓性能。材料厚度通常小于3.0mm。素材表面無(wú)防護(hù)層，在自然環(huán)境中易氧化生銹�？梢酝ㄟ^如下加工方式獲得表面防護(hù)： 度錫 電泳 噴油 噴粉 發(fā)黑等，其中電鍍后既能獲得表面防護(hù)且更易焊錫，在電子產(chǎn)品中廣泛應(yīng)用。 |
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gao26gao
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3樓2013-11-26 14:59:57
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gao26gao(RXMCDM代發(fā)): 金幣+1, 多謝應(yīng)助！ 2014-01-20 00:18:06
gao26gao(RXMCDM代發(fā)): 金幣+1, 多謝應(yīng)助！ 2014-01-20 00:18:06
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The surface of SECC electrolytic plate material and the performance with SPCC the same material increases the galvanized layer surface, play the effect of protective , without the function of making the solder, stamping section no protective layer by stamping process, oxidation occurs in the natural environment. SPCC single light board is a kind of cold rolled sheet. Made of quality carbon steel, which has good mechanical properties and stamping performance. The thickness of the material is usually less than 3.0mm. Material surface without protective layer, in the natural environment and easy rust. Can be obtained through the following process: surface protection of tin electrophoretic injection powder such as black, which after plating can obtain the surface protection and easier to solder, widely used in electronic products. |
2樓2013-11-26 13:14:58
lisaky
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真強(qiáng)必勝: 金幣+1, 謝謝 2013-12-11 08:55:03
RXMCDM: 金幣+5, 多謝應(yīng)助！ 2014-01-20 00:19:33
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RXMCDM: 金幣+5, 多謝應(yīng)助！ 2014-01-20 00:19:33
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The material and performance of SECC Electrolysis board is the same as SPCC. Material surface increases zinc coat which plays the role in surface protection, but does not have solder function. There is no protective layer when making stamping section by stamping process, so oxidation occurs in the natural environment. SPCC single light board is a kind of cold-rolled plate. The material is high-qualified carbon, and has good mechanical properties and stamping performance. Material thickness is generally less than 3.0mm. Material surface has no protective layer, which leads to easy oxidation and rustiness in a natural environment. Surface protection can be obtained from processing methods followed: degree tin, electrophoresis, injector, dusting, nigrescence and so on. Surface protection can be obtained after plating and easier to be soldered, and widely used in electronic products. |
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