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89333627金蟲 (小有名氣)
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[求助]
請(qǐng)高手幫忙潤(rùn)色一段話(附中文解釋)
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請(qǐng)高手幫忙潤(rùn)色一段話,哪有不對(duì)的幫忙改改,我將感激不盡。 The main role of the resin matrix of z-pins is to keep the fiber bundle rigid, so that it can be implanted into the through thickness of the laminates. As for toughening effect, compared with z-pin(a composite of fiber bundle and resin matrix), fiber bundle without resin has a larger contact area and bonded better with laminate. Besides, less initial crack is caused by the thermal residual stresses. The presence of the resin matrix of z-pin has little beneficial into the interface between z-pin and laminates. It will be ideal if such kind of resin matrix can be found, in the implantation process, the resin can transfer load and keep the fiber bundle rigid; after the z-pin is implanted into the laminates, the resin can be removed, and only the fiber bundle remains. Thereafter, the interface between z-pin and laminates is converted into the interface between the fiber bundles and the matrix of the laminates, which will improve the interfacial properties, and reduce the thermal residual stresses both to a large extent. For this kind of z-pins, the most required mechanical performance is to have good piercing properties so that it can be implanted into the laminates smoothly. 請(qǐng)對(duì)比中文原文: z-pin的樹脂的主要作用是使纖維束變硬,從而使纖維束能夠植入到層合復(fù)合材料的厚度方向. 對(duì)于增韌效果, 與z-pin (纖維束與樹脂的復(fù)合材料) 相比, 不帶樹脂的纖維束具有與層合板間更大的接觸面積, 且粘結(jié)的更好. 此外,由熱殘余應(yīng)力而導(dǎo)致的初始裂紋也會(huì)更少, 因此, z-pin樹脂的存在對(duì)z-pin與層合板之間的界面性能上沒有什么好處.如果能夠找到這樣一種樹脂是非常理想的,在植入過程中,樹脂能夠傳遞載荷使纖維束變硬, 當(dāng)植入到層合板以后,這種樹脂可以去除,只留下纖維束. 于是z-pin與層合板之間的界面就轉(zhuǎn)換成了纖維束與層合板基體之間的界面, 這既能夠很大程度的提高界面性能又能夠降低殘余應(yīng)力. 而對(duì)于這種z-pin來說,最需要的就是具有較好的穿刺性能 從而能夠順利的植入到層合板中. |
至尊木蟲 (知名作家)
Translator and Proofreader
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As always, it was very well written! The main role of the resin matrix of z-pins is to keep the fiber bundle rigid, so that it can be implanted into the through thickness of the laminates. As for 【也可用With regard to】toughening effect, compared with z-pin(a composite of fiber bundle and resin matrix), fiber bundle without resin has a larger contact area and bonded 【bonds】 better with laminate. Besides, less initial crack is caused by the thermal residual stresses. The presence of the resin matrix of z-pin has little beneficial into 【has little beneficial effect/impact on】 the interface between z-pin and laminates. It will be ideal if such kind of resin matrix can be found, 【.上句完結(jié)于此】in 【In重開始一句】 the implantation process, the resin can transfer load and keep the fiber bundle rigid; after the z-pin is implanted into the laminates, the resin can be removed, and only the fiber bundle remains. Thereafter, the interface between z-pin and laminates is converted into the interface between the fiber bundles and the matrix of the laminates, which will improve the interfacial properties, and reduce the thermal residual stresses both to a large extent 【to a large extent in both cases】. For this kind of z-pins, the most required mechanical performance is to have good piercing properties so that it can be implanted into the laminates smoothly. As for toughening effect, compared with z-pin(a composite of fiber bundle and resin matrix), fiber bundle without resin has a larger contact area and bonded better with laminate. 可改為: With regard to the toughening effect, fiber bundle without resin has a larger contact area and bonds better with laminate as compared with z-pin(a composite of fiber bundle and resin matrix). |
金蟲 (小有名氣)
金蟲 (小有名氣)
至尊木蟲 (知名作家)
Translator and Proofreader
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